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Semiconductor device fabrication -- using Silicon
as the most commonly used semiconductor material -- is the
process used to create chips, the integrated circuits that are present in
everyday electrical and electronic devices. It is a multiple-step sequence of
photographic and chemical processing steps during which electronic circuits are
gradually created on a wafer made of pure semi-conducting material.
The entire manufacturing process from start to packaged chips ready for shipment
it is performed in highly specialized facilities
referred to as fabs using processing techniques such as
Wafer processing
Wet cleans ,
Photolithography , Ion implantation ,
Dry etching ,
Wet etching ,
Plasma ashing ,
Thermal treatments ,
Chemical vapor deposition (CVD) ,
Physical vapor deposition (PVD) ,
Molecular beam epitaxy (MBE) ,
Electrochemical Deposition (ECD). ,
Chemical-mechanical planarization (CMP) , Wafer testing ,
Wafer backgrinding,
Die preparation
Wafer mounting ,
Die cutting
IC packaging
Die attachment ,
IC Bonding: (Wire bonding , Flip chip , Tab bonding ), IC encapsulation
( Baking , Plating , Lasermarking ,
Trim and form )
IC testing
main equipment include :
Wafer Manufacturing Equipment, Refurbished Semiconductor Machines, Spare
parts, Accessories, Test
equipment for development and production of microelectronic devices.
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